Multi-die Integration Packaging Solution

SJSemi devotes to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develops to provide the advanced 3D Multi-Die Integration technology and solutions.


SJSemi Funded the Financing by $280M

September 16 is a special day for SJSEMI. On September 16,2014, SJSEMI settled in Jiangyin with a team of 6 people; On September 16,2015, the signing ceremony of 2nd round of intention increasing was held in Beijing. Now SJSEMI has become a big family with about 200 people.

This financing funded $280M and SMIC continues to make great investment to maintain the dominant status; National IC Industry Fund as the new investor and the investment of Qualcomm is also particular for us. Not only the investors performed the great enthusiasm, but also the top leaders attended the event as well as the high tech department of National Development and Reform Commission, the electronic department of Ministry of Industry and Information Technology and the local government.

Dr.Zhou indicated that our shareholders-the biggest IC design company Qualcomm, the National IC Industry Fund, the front processing company SMIC and other assembly companies which form a complete industrial chain. As the company of MEOL (Middle-End-Of-Line), combination is as important as specification.

The CEO of Qualcomm also indicated that this event was extremely important among Qualcomm, SJSEMI, SMIC and the National IC Industry Fund. It would be one of the most important strategic investment plans in China and also meant that Qualcomm would support the development of semiconductor in China as always.

It had been one year since SJSEMI founded. We had completed the test and the certification within this year and hopefully to provide the mass processing to our customers in early 2016. The success could not be achieved without the efforts of everyone.