Multi-die Integration Packaging Solution

SJSemi devotes to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develops to provide the advanced 3D Multi-Die Integration technology and solutions.


SJSemi signs contract in Jiangyin to expand investment of $1.6 billion and strengthen its leading position in 3D Multi-Die integrated packaging

       On January 20, 2022, Jiangyin, Jiangsu Province, SJSemi, a leading MEOL (Middle-End-Of-Line) foundry and 3D integrated packaging company, signed an investment agreement with Jiangyin Municipal Government and Jiangyin High-tech Industrial Development Zone Management Committee (hereinafter referred to as "Management Committee") for a 12-inch MEOL (Middle-End-Of-Line) manufacture and 3D Multi-Die integrated packaging project, using SJSemi as the carrier, with a total investment of $1.6 billion and an increase in registered capital to $830 million. Construction of the J2B fab is planned to begin in February 2022, and through quality improvement and capacity expansion, a monthly output of 120,000 wafer level packaging and 20,000 3D Multi-Die integration packaging will be achieved.


       SJSemi is the first corporation in Mainland China dedicated to 12-inch high-density bumping, and the first to 8-inch bumping and wafer level packaging. Since startup in Jiangyin in the autumn of 2014, the company has achieved four consecutive years of sales revenue doubling and sustained rapid development, becoming the head of advanced wafer level packaging. Despite the impact of external uncontrollable factors, the company has achieved sustained growth in 2021. SJSemi focuses on R&D investment, innovates and develops 3D Multi-Die integration technology to meet the comprehensive demands for advanced packaging in new applications such as 5G, artificial intelligence, high performance computing, automotive electronics, etc. According to KnowMade, a French third-party organization, SJSemi owns the world's largest number of patents in the area of 5G millimeter-wave antenna packaging. The expansion of investment and the plan to start the construction of the J2B fab will effectively support the company's long-term development strategy. 

      Dong Cui, the Chairman and CEO of SJSemi, said that the launch of the new project marks a further scaling up and expanding of SJ Semi's core business, so as to enable more leading innovative processes to be industrialized. The acceleration of mass production of 3D Multi-Die integration will also lead the company to a newer frontier and a higher level of the industry, as well as advancing the development of the IC industry ecosystem.