Multi-die Integration Packaging Solution

SJSemi devotes to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develops to provide the advanced 3D Multi-Die Integration technology and solutions.


The J2A of SJSemi Went into Operation

December 30, 2019, the clean room of J2A 1F of SJ Semiconductor (Jiangyin) Corporation was put into use on schedule, and the first equipment moved in the clean room successfully. The management team and all staff involved in J2A operation participated in the ceremony.


The first Bumping equipment was moved into clean room officially at 9 a.m.  Senior vice president Mr Jianwen Li said it was very valuable to realize several handover procedures today. There was no guarantee that the equipment would be moved in on time today as long as any of the procedures not achieved, the schedule of constructions, indicators of the clean room, equipment purchasing, logistics, etc. The whole company worked together to demonstrate efficient execution.


At 9:30 am, Mr. Dong Cui, CEO of the company, announced that the J2A operation officially began. J2A will help us to continue our growth plan, not only to expand capacity in bumping and WLCSP, but also to increase RD investments to meet the demands from advanced wafer packaging in market like 5G, AI, IOT and automotive electronics. “ SJSemi will continue to innovate, speed up on RD projects and be at full steam to develop the advanced 3D-IC business.”