Based on SJSemi's novel, patented SmartPoser™ technology platform, SJSemi continues striving for 3D heterogeneous integration of active and passive devices to achieve high bandwidth, high speed and low power consumption for gaining higher system level performance in light of the post Moore’s law era.
SmartAiP™, the world’s first 5G mm-Wave ultra-wideband dual polarization AiP package technology.
The SmartAiP™ realizes the dream characteristics for the 5G mm-Wave. Its ultra-wideband works from 24GHz to 43 GHz. Its 12.5 dB ultra-high gain is about 4 folds of the existing solutions. Besides, it has handset friendly form factor with less than 1 mm thickness, and still roomy for RFFE module integration and good at heat dissipation.
SmartPoser™ the novel, patented technology enables 3D integration of the active and passives devices. This 3D integration leads to lower power delivery loss and higher performance per watt. Its key enabling technologies comprise of ultra-high Cu vertical interconnect, multi-layer double sided fine pitch RDLs, wafer-level multi-layer precise aligned antennas, flip-chip and SMT. These technologies empower the fully integration of the 5G antennas, RFFE modules and transceivers within a small form factor in less than 1mm thickness. Its low power consumption, slim form factor and high gain are tailor fits to the 5G mm-Wave handsets besides the HVM proven wafer fab streamline and its simplified supply chain compared to current solutions on the market.
01Realize high density, high integrated and super thin 3D integration by SmartAiP™ technology platform.
023DFO is the wafer level system package technology derived by SmartAiP™ technology platform, which has high density RDL and TIV to realize high density inter-connection, and to provide high performance package solutions for various applications, such as mobile, high performance computation.
