CP (Chip Probing) is to test the electrical and functional performance of the chips on wafer level by using Automatic Test Equipment(ATE) and probe cards. While to save overall assembly and package cost by screening out failed dies, CP testing is valuable for IC chip design and manufacturing efficiency.
Originated in 2000 as a business service unit of a leading foundry in China, was spinned off and dedicated as SJSemi’s CP operation since 2015. With more than 15 advanced ATE test platforms, SJSemi has 400 sets of tester equipped with advanced production and self-developed EAP systems to provide customer with high quality one-stop test services，covering test program development, probe card maintenance, test hardware design and total test solution development for Logic SOC, Memory, Mix signal IC etc… As part of advanced packaging full TK service as well as supporting WLCSP and bumping, CP test plays a crucial role for cost saving and overall competitiveness for customer.
