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Multi-die Integration Packaging Solution

SJSemi is the first Middle-End-Of-Line (MEOL) pure play foundry equipped with Front-End-Of-Line (FEOL) manufacturing and quality system, serving global customers.

Service content

SJSemi is born for China’s First Dedicated 12” Bumping Line to support industry advancement while proceeding for 3DIC.

Wafer Bumping

Bumping is a wafer level advanced packaging technology. The bumps are typically formed upon under bump metallization (UBM) which is electroplated on the die pads openings.

Dedicated to provide bumping and other advanced wafer level packaging services, professional enginee...

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CP Test

CP (Chip Probing) is to test the electrical and functional performance of the chips on wafer level by using Automatic Test Equipment(ATE) and probe cards.

CP (Chip Probing) is to test the electrical and functional performance of the chips on wafer level b...

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WLCSP

SJSemi’s WLCSP solution providing the best service to global top chip design houses and end product customers, can meet different product application and technologies.

As performance, form factor, power consumption and cost become more demanding for mobile and portabl...

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R & D direction

SmartPoser™This innovative chip integrated packaging structure and technology, which has been patented in China and the United States

SmartPoser™This innovative chip integrated packaging structure and technology, which has been patent...

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