SJSemi devotes to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develops to provide the advanced 3D Multi-Die Integration technology and solutions.
At 9:28 am on February 18, 2022, SJSemi，The groundbreaking ceremony for 3DIC packaging project（J2B plant）of SJ Semiconductor Corp. （hereinafter referred to as SJSemi）was held successfully. Zhao Jianjun , deputy Secretary of wuxi Municipal Party Committee and acting Mayor, Xu Feng, member of the Standing Committee of Wuxi Municipal Committee and Secretary of Jiangyin Municipal Party Committee, Gao Yaguang , Deputy Mayor of Wuxi, Bao Ming, Ji Jun , Wensong Shao and other municipal leaders of Jiangyin attended the ceremony.
Mr. Cui Dong，Chairman of SJSemi ，introduced the basic situation of SJSemi and the project.He welcomed the visit of the leaders and guests，expressed his gratitude to all relevant government departments for their strong support to the project. He said that SJSemi will pay close attention to construction schedule and the quality of the project, implement Equipment procurement and building productivity simultaneously to strive for an early production, rapid reaches producing, Live up to the trust and expectation of investors, customers and all aspects.
The multi-chip integrated packaging project, with an investment of $1.6 billion, includes J2B main plant and power plant totaling 87,000 square meters, which is expected to be completed and put into use by the end of 2023. After the completion ，SJSemi will has nissan 120000 wafer level packaging and 20000 chip integrated processing capacity, providing customers with higher quality, more advanced forms of one-stop packaging services, better meet 5g, IoT, high-end consumer electronics, automotive electronics and other emerging market demand for advanced packaging, to consolidate and strengthen the company's industry position, Promote the continuous and rapid development of the company.
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